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Shenzhen KHJ Technology Co., Ltd

Semiconductor Processing Tapes Solution Provider

Manufacturer from China
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Thermal Release Tape

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Shenzhen KHJ Technology Co., Ltd
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 Thermal Release Tape
China Thermal Release Tape TS600D – Temporary Bonding Film for Semiconductor Wafer Processing & Die Sorting for sale

Thermal Release Tape TS600D – Temporary Bonding Film for Semiconductor Wafer Processing & Die Sorting

Description TS600D is a Blue thermal release tape with high initial viscosity. At (105-110℃), The stickiness of the adhesive surface disappears and .....
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China TS650RN Thermal Release Tape for Semiconductor Wafer Dicing & Backgrinding | Heat-Activated No-Residue Temporary Bonding Tape PET Substrate 110-140°C | SMT Die-Cutting Electronics Manufacturing | KHJ for sale

TS650RN Thermal Release Tape for Semiconductor Wafer Dicing & Backgrinding | Heat-Activated No-Residue Temporary Bonding Tape PET Substrate 110-140°C | SMT Die-Cutting Electronics Manufacturing | KHJ

Description TS650RN is a white translucent thermal separation tape with high initial viscosity. At a certain temperature (110~140℃), the adhesive ......
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China DTS640A Double-Sided Heat Release Tape for Semiconductor Wafer Thinning Die-Bond | Adjustable 90-150C Clean-Release No-Residue Auto-Peel PET Film | Chip Inductor Sapphire LCD Cutting Automation | KHJ for sale

DTS640A Double-Sided Heat Release Tape for Semiconductor Wafer Thinning Die-Bond | Adjustable 90-150C Clean-Release No-Residue Auto-Peel PET Film | Chip Inductor Sapphire LCD Cutting Automation | KHJ

1. Product Description DTS640A is a double-sided tape with good initial tack. One side features a foamed (thermally expandable) adhesive layer, while ...
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China TS652D Thermal Release Tape for Wafer Dicing & Semiconductor Backgrinding | Heat-Activated No-Residue Temporary Bonding Tape PET 110-140C | MLCC LED Cutting&Die-Sorting Electronics Manufacturing | KHJ for sale

TS652D Thermal Release Tape for Wafer Dicing & Semiconductor Backgrinding | Heat-Activated No-Residue Temporary Bonding Tape PET 110-140C | MLCC LED Cutting&Die-Sorting Electronics Manufacturing | KHJ

Description TS652D is a white film backed pressure-sensitive adhesive single- sided coated thermal release tape.With a high initial adhesion and ...
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China DTS641A Double-Sided Heat Release Tape for MLCC Semiconductor Wafer Dicing Backgrinding | High-Adhesion No-Residue Thermal Debonding PET 90-150C | PCB Ceramic Glass LED Cutting Temp Fix Assembly | KHJ for sale

DTS641A Double-Sided Heat Release Tape for MLCC Semiconductor Wafer Dicing Backgrinding | High-Adhesion No-Residue Thermal Debonding PET 90-150C | PCB Ceramic Glass LED Cutting Temp Fix Assembly | KHJ

Product Description DTS641A is a double-sided tape with good initial tack. Both sides are covered with foam rubber layers. Under the condition of 110....
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