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Shenzhen KHJ Technology Co., Ltd

Semiconductor Processing Tapes Solution Provider

Manufacturer from China
Site Member
6 Years
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Home / Products / Semiconductor Packaing Tape / UV396US UV Release Tape for BGA Semiconductor Packaging | UV-Curable Low Residue Dicing Tape for Wafer Processing, Die Bonding, Back Grinding & Chip Mounting - B2B Custom Wholesale KHJ Manufacturer /

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Semiconductor Packaing Tape

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smt spilice tool

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SMT Splice Tape & tool

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SMT Stencil Cleaning Wiper

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Thermal Release Tape

 [5]

UV Release Tape

 [3]

ESD Adhesive Tape

 [16]

Masking Tape

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Foam Tapes

 [6]

Heat Resistant Adhesive Tape

 [24]

Polyimide Heat Resistant Tape

 [26]

Heat Resistant Double Sided Tape

 [5]

Polyester Adhesive Tape

 [3]

Adhesive Tape Roll

 [7]

Bonding Tape

 [5]

Precision Die Cutting

 [12]

Kapton Tape

 [3]

Discontinued Models

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Shenzhen KHJ Technology Co., Ltd
City:shenzhen
Country/Region:china
Contact Person:MsKarina
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UV396US UV Release Tape for BGA Semiconductor Packaging | UV-Curable Low Residue Dicing Tape for Wafer Processing, Die Bonding, Back Grinding & Chip Mounting - B2B Custom Wholesale KHJ Manufacturer
UV396US UV Release Tape for BGA Semiconductor Packaging | UV-Curable Low Residue Dicing Tape for Wafer Processing, Die Bonding, Back Grinding & Chip Mounting - B2B Custom Wholesale KHJ Manufacturer
  • UV396US UV Release Tape for BGA Semiconductor Packaging | UV-Curable Low Residue Dicing Tape for Wafer Processing, Die Bonding, Back Grinding & Chip Mounting - B2B Custom Wholesale KHJ Manufacturer
Products Detailed
Description UV396US is a single-sided, UV-curable release tape engineered for temporary bonding applications. It offers strong initial tack that holds ...
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