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Shenzhen KHJ Technology Co., Ltd

Semiconductor Processing Tapes Solution Provider

Manufacturer from China
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6 Years
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Home / Products / UV Release Tape / UV Release Tape UV396US – Photosensitive Debonding Film for Wafer Grinding & Dicing /

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Shenzhen KHJ Technology Co., Ltd
City:shenzhen
Country/Region:china
Contact Person:MsKarina
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UV Release Tape UV396US – Photosensitive Debonding Film for Wafer Grinding & Dicing
UV Release Tape UV396US – Photosensitive Debonding Film for Wafer Grinding & Dicing
  • UV Release Tape UV396US – Photosensitive Debonding Film for Wafer Grinding & Dicing
  • UV Release Tape UV396US – Photosensitive Debonding Film for Wafer Grinding & Dicing
  • UV Release Tape UV396US – Photosensitive Debonding Film for Wafer Grinding & Dicing
Products Detailed
Description UV396US is a single-sided UV debonding tape with high initial stickiness, and after UV irradiation, the adhesive side will stick The ...
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