Shenzhen KHJ Technology Co., Ltd
Manufacturer of semiconductor adhesive film solutions
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· After UV light, it is easy to peel off, with a soft buffer layer;
· Better conformability and heat resistance.
| Sticking items | condition | Measured value (g/25mm) | notes |
| SUS | Before UV irradiation | 960 | 180°peel |
| SUS | After UV irradiation | 20 | 180°peel (200mm/min) |
| Model | Bacjing | Total thickne(um) | Surface roughness(um) | Adhesive thickness(um) | Peel strength (g/inch) | Product Features |
| E1-IH803 | PI | 25 | 30 | 50# | ≥400 | Silicone type, anti-static, suitable for large BGA high temperature Protect. High temperature resistance 260°C, no glue residue. |
| E1-IH803H | PI | 25 | 30 | 50# | ≥400 | Silicone type, anti-static, suitable for large BGA high temperature Protect. High temperature resistance 290°C, no glue residue. |
| IH890SY | PI | 25 | 20 | 50# | Non-silicone type, high temperature resistance, slightly low viscosity, special PI substrate, Thermal deformation is extremely small, suitable for small-sized BGA shielding protection, resistant to High temperature 260°C 10min/200°C, 1H to remove no residue, No metallic yellowing. | |
| UV408CP | PET composite material | 100 | 30 | 50# | ≥900 UV＜20g | After UV light, it is easy to peel off and has a soft cushion Layer, better fit performance, with heat resistance. |