Shenzhen KHJ Technology Co., Ltd
Manufacturer of semiconductor adhesive film solutions
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KD8016M is a polyimide film-backed Polyimide Tapes featuring superior heat resistance and extremely low electrostatic discharge properties, along with insulation Resistance on either side. Insulation Resistance of Adhesive Side can also be measured.
Features
Low Electrostatic Discharge during Unwind & Removal; Heat Resistant up to 290; Excellent Tensile Strength & Elongation properties are provided with this fabric.
Application
RoHS Compliant Solder Mask for Print Circuit Boards in Wave Sold or Reflow Soldering Process with no residue build up at high temperature.
| Item | Typical Value | Test Method |
| Backing | 0.025mm | / |
| Total Thickness | 0.045±0.005mm | / |
| Adhesion to Steel | 3N/25mm | GBT 2792-2014 |
| Tensile Strength | ≥3.5 (KN/M) | GBT 30776-2014 |
| Elongation | ≥45% | |
| Surface Resistance | 105-1010ohms | / |
| Static Discharge | <100V | / |
| Operating Temperature | 290℃ | 5min Testing to Stainless steel plate |
Storage
Store between 10- 30% relative humidity for optimal storage conditions (R.H). Avoid direct sunlight. Shelf Life of Initial Packaging When Stored Correctly is 12 months from Date of Manufacture.
Precaution Reminder
Packing surfaces must be free from dust, oil or any other contaminants before application by roller, hand or press. Adhesion reduction must also be prevented through repeated sticking processes by using roller, hand or press pressure and not repeat stickings.
Notes
Please be aware that this Technical Data Sheet was written based solely on our laboratory tests and experience, not your specific application requirements. Before considering use for any intended application requirements. It remains your responsibility as customer to evaluate this product based on intended application needs before authorizing use for such product.