Shenzhen KHJ Technology Co., Ltd
Manufacturer of semiconductor adhesive film solutions
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IH8607 Polyimide Film-backed Caption tape offers superior heat resistance and insulation properties, making it suitable for high temperature environments.
Electrical Insulation Features and Clean Removal Without Residue. 280 for 5 minutes Resistance with Excellent Tensile Strength & Elongation Properties; RoHS Compliant.
Applications-Supply of printed circuit boards during wave solder or solder dip processes; masking contacts during spray painting, powder coating & solder coating processes. Bundling transformers, motors, batteries & electronic components together for insulation purposes.
| Item | Typical Value | Test Method | |
| Imperial | Metric | ||
| Backing | 1.0mil | 0.025mm | / |
| Total Thickness | 2.2mil | 0.055±0.005mm | / |
| Tack | / | ≥26(J.DOW/#) | / |
| Adhesion to Steel | 0.91~1.37lbs/in | 4~6N/25mm | GBT 2792-2014 |
| Tensile Strength | ≥20lbs/in | ≥3.5(KN/M) | GBT 30776-2014 |
| Elongation | ≥45% | ≥45% | GBT 30776-2014 |
| Dielectric Strength | >4000V | >4000V | / |
| Maximum Operating Temperature | 536℉ | 280℃ | / |
Storage should take place under typical conditions of between 10-30% relative humidity (R.H), out of direct sunlight.
Shelf Life: 12 months from date of manufacturing when stored properly in initial packaging.
Precaution Reminder Surface should be clean, dry and free from dust, oil or other contaminants when applying pressure by roller, hand or press. Repeat sticking should be avoided to prevent adhesion loss.
Notes
Please be aware that this technical data sheet has been prepared based on our own laboratory testing and experience only, and must be evaluated by each customer in terms of meeting intended application needs before being approved for use.